Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 44
... Refractive index data are plotted in Figure 4. Increasing the temperature , adding hydrogen , and / or using dual frequency all serve to raise the refractive index . Dual frequency ( process 1 ) appears to have the biggest effect . The ...
... Refractive index data are plotted in Figure 4. Increasing the temperature , adding hydrogen , and / or using dual frequency all serve to raise the refractive index . Dual frequency ( process 1 ) appears to have the biggest effect . The ...
Page 121
16 1.55 4.2 Refractive Index Fluorine content 4.0 12- 1.50 10- Fluorine Concentration ( at . % ) 1.45 1.40 Refractive Index Dielectric Constant 3.8 3.6 3.4 124 3.2 1.35 3.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 SIF / 02 Fig.1 F ...
16 1.55 4.2 Refractive Index Fluorine content 4.0 12- 1.50 10- Fluorine Concentration ( at . % ) 1.45 1.40 Refractive Index Dielectric Constant 3.8 3.6 3.4 124 3.2 1.35 3.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 SIF / 02 Fig.1 F ...
Page 196
... refractive index as a function of the cure temperature . At lower temperature a slight increase of the film thickness ' was actually observed . This phenomenon is accompanied by a decrease in the refractive index - its value for as ...
... refractive index as a function of the cure temperature . At lower temperature a slight increase of the film thickness ' was actually observed . This phenomenon is accompanied by a decrease in the refractive index - its value for as ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films