Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 44
... Refractive index data are plotted in Figure 4. Increasing the temperature , adding hydrogen , and / or using dual frequency all serve to raise the refractive index . Dual frequency ( process 1 ) appears to have the biggest effect . The ...
... Refractive index data are plotted in Figure 4. Increasing the temperature , adding hydrogen , and / or using dual frequency all serve to raise the refractive index . Dual frequency ( process 1 ) appears to have the biggest effect . The ...
Page 121
16 1.55 4.2 Refractive Index Fluorine content 4.0 12- 1.50 10- Fluorine Concentration ( at . % ) 1.45 1.40 Refractive Index Dielectric Constant 3.8 3.6 3.4 124 3.2 1.35 3.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 SIF / 02 Fig.1 F ...
16 1.55 4.2 Refractive Index Fluorine content 4.0 12- 1.50 10- Fluorine Concentration ( at . % ) 1.45 1.40 Refractive Index Dielectric Constant 3.8 3.6 3.4 124 3.2 1.35 3.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 SIF / 02 Fig.1 F ...
Page 196
... refractive index as a function of the cure temperature . At lower temperature a slight increase of the film thickness ' was actually observed . This phenomenon is accompanied by a decrease in the refractive index - its value for as ...
... refractive index as a function of the cure temperature . At lower temperature a slight increase of the film thickness ' was actually observed . This phenomenon is accompanied by a decrease in the refractive index - its value for as ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber