Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 22
... Aerogels Porous Silica Aerogel ( k ≤ 2.5 ) 15 Polynaphthalene - N ( k = 2.4 ) * Polynaphthalene - F ( k = 2.3 ) Fluorinated amorphous carbon ( k = 2.1 ) * Fluorinated hydrocarbon ( k = 2.0 - 2.4 ) Teflon - AF ( k = 1.93 ) Thermal CVD ...
... Aerogels Porous Silica Aerogel ( k ≤ 2.5 ) 15 Polynaphthalene - N ( k = 2.4 ) * Polynaphthalene - F ( k = 2.3 ) Fluorinated amorphous carbon ( k = 2.1 ) * Fluorinated hydrocarbon ( k = 2.0 - 2.4 ) Teflon - AF ( k = 1.93 ) Thermal CVD ...
Page 91
... silica ( also known as aerogels or low density xerogels ) for ILD and IMD applications . Advantages of these materials include high thermal stability , small pore size , and similarity to conventional deposition processes , precursors ...
... silica ( also known as aerogels or low density xerogels ) for ILD and IMD applications . Advantages of these materials include high thermal stability , small pore size , and similarity to conventional deposition processes , precursors ...
Page 92
... silica parameter controlling properties of importance for dielectrics ... aerogels which had been prepared using supercritical Dielectric constant ... silica density values less than 1 g / cm3 ( porosity > 55 % ) , the dielectric constant ...
... silica parameter controlling properties of importance for dielectrics ... aerogels which had been prepared using supercritical Dielectric constant ... silica density values less than 1 g / cm3 ( porosity > 55 % ) , the dielectric constant ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber