Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 15
... spin cast onto an appropriate substrate . Then , a thermal curing process is used to drive off the solvent and initiate imide ring closure which produces the insoluble polyimide . The resultant spin coated films are inherently ...
... spin cast onto an appropriate substrate . Then , a thermal curing process is used to drive off the solvent and initiate imide ring closure which produces the insoluble polyimide . The resultant spin coated films are inherently ...
Page 105
... spin - coating water / ethanol - based solutions containing a silica precursor and surfactant template . In this paper , film deposition conditions are described , and film thickness , porosity , refractive index and dielectric constant ...
... spin - coating water / ethanol - based solutions containing a silica precursor and surfactant template . In this paper , film deposition conditions are described , and film thickness , porosity , refractive index and dielectric constant ...
Page 106
... Spin - coating solutions were prepared by combining tetraethyl orthosilicate ... coated wafer was post - treated , including heating at 105 ° C for several ... spin - coating solutions does not yield ordered mesoporous silica . These ...
... Spin - coating solutions were prepared by combining tetraethyl orthosilicate ... coated wafer was post - treated , including heating at 105 ° C for several ... spin - coating solutions does not yield ordered mesoporous silica . These ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films