Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 8
... spin - on planarization characteristics of BCB polymers are exceptional compared to many materials . It has been suggested that in some cases , the planarization achieved could eliminate the need for CMP process steps [ 21 ] . The ...
... spin - on planarization characteristics of BCB polymers are exceptional compared to many materials . It has been suggested that in some cases , the planarization achieved could eliminate the need for CMP process steps [ 21 ] . The ...
Page 21
... on new polymers , deposited by either spinning or CVD methods . Two classes of requirements have to be satisfied for a material to be successful , i.e. , used in volume device manufacturing . First , a set ... Spin - on Polymers Fluorinated.
... on new polymers , deposited by either spinning or CVD methods . Two classes of requirements have to be satisfied for a material to be successful , i.e. , used in volume device manufacturing . First , a set ... Spin - on Polymers Fluorinated.
Page 195
... spin - on - glass ( SOG ) is regarded as a potential low - k material for multilevel metallization ( MLM ) schemes . In this work we report on the properties of films which have been cured at different temperatures covering the range from ...
... spin - on - glass ( SOG ) is regarded as a potential low - k material for multilevel metallization ( MLM ) schemes . In this work we report on the properties of films which have been cured at different temperatures covering the range from ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber