Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 26
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
Page 59
... stability ( at least 450 ° C for up to 2 h ) , moisture absorption ( below 1 % ) , good adhesion to the substrate , glass transition temperature , coefficient of thermal expansion , me- chanical stability , planarization and mechanical ...
... stability ( at least 450 ° C for up to 2 h ) , moisture absorption ( below 1 % ) , good adhesion to the substrate , glass transition temperature , coefficient of thermal expansion , me- chanical stability , planarization and mechanical ...
Page 155
... stability as DLC films with k > 3.3 . The thermally stable FDLC films have internal stresses < 300 MPa and are thus promising candidates as a low - k ILD . For the range of Si contents examined ( 0-9 % C replacement by Si ) , SiDLC ...
... stability as DLC films with k > 3.3 . The thermally stable FDLC films have internal stresses < 300 MPa and are thus promising candidates as a low - k ILD . For the range of Si contents examined ( 0-9 % C replacement by Si ) , SiDLC ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber