Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 103
... test this hypothesis , a SEM sample was prepared with a focus ion beam ( FIB ) tool which will not induce stress on ... structure . The interface between PETEOS and xerogel films was well defined . Spectroscopic ellipsometry studies showed ...
... test this hypothesis , a SEM sample was prepared with a focus ion beam ( FIB ) tool which will not induce stress on ... structure . The interface between PETEOS and xerogel films was well defined . Spectroscopic ellipsometry studies showed ...
Page 108
... structure is lamellar with poor thermal stability . The pores are well ordered within a narrow composition range ... test ( ASTM D3359 ) even for the most porous films . Film hardness was measured qualitatively with a scratch test ( ASTM ...
... structure is lamellar with poor thermal stability . The pores are well ordered within a narrow composition range ... test ( ASTM D3359 ) even for the most porous films . Film hardness was measured qualitatively with a scratch test ( ASTM ...
Page 167
... structure was formed above the aluminum wiring . The deposition of amorphous carbon is enhanced by ion bombardment ... structures avoided by using CFx ions . To test this approach , we deposited a - C : F films while applying a bias ...
... structure was formed above the aluminum wiring . The deposition of amorphous carbon is enhanced by ion bombardment ... structures avoided by using CFx ions . To test this approach , we deposited a - C : F films while applying a bias ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films