Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 103
... test this hypothesis , a SEM sample was prepared with a focus ion beam ( FIB ) tool which will not induce stress on ... structure . The interface between PETEOS and xerogel films was well defined . Spectroscopic ellipsometry studies showed ...
... test this hypothesis , a SEM sample was prepared with a focus ion beam ( FIB ) tool which will not induce stress on ... structure . The interface between PETEOS and xerogel films was well defined . Spectroscopic ellipsometry studies showed ...
Page 108
... structure is lamellar with poor thermal stability . The pores are well ordered within a narrow composition range ... test ( ASTM D3359 ) even for the most porous films . Film hardness was measured qualitatively with a scratch test ( ASTM ...
... structure is lamellar with poor thermal stability . The pores are well ordered within a narrow composition range ... test ( ASTM D3359 ) even for the most porous films . Film hardness was measured qualitatively with a scratch test ( ASTM ...
Page 167
... structure was formed above the aluminum wiring . The deposition of amorphous carbon is enhanced by ion bombardment ... structures avoided by using CFx ions . To test this approach , we deposited a - C : F films while applying a bias ...
... structure was formed above the aluminum wiring . The deposition of amorphous carbon is enhanced by ion bombardment ... structures avoided by using CFx ions . To test this approach , we deposited a - C : F films while applying a bias ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber