Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 11
... thermal stability is essentially that of conventional SiO2 . In addition to possessing higher thermal stability than other low & materials , attributes of nanoporous silica include the ability to tailor the density and porosity ( and ...
... thermal stability is essentially that of conventional SiO2 . In addition to possessing higher thermal stability than other low & materials , attributes of nanoporous silica include the ability to tailor the density and porosity ( and ...
Page 26
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
Page 59
... Thermal stability ( at least 450 ° C for up to 2 h ) , moisture absorption ( below 1 % ) , good adhesion to the substrate , glass transition temperature , coefficient of thermal expansion , me- chanical stability , planarization and ...
... Thermal stability ( at least 450 ° C for up to 2 h ) , moisture absorption ( below 1 % ) , good adhesion to the substrate , glass transition temperature , coefficient of thermal expansion , me- chanical stability , planarization and ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films