Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 7
... thermosetting polymers developed by Dow Chemical Co. [ 19 ] . The derivatives most widely discussed are designated as Cyclotene TM , and are based on the thermally - induced Diels - Alder polymerization of 1,3 - divinyl - 1,1,3,3 ...
... thermosetting polymers developed by Dow Chemical Co. [ 19 ] . The derivatives most widely discussed are designated as Cyclotene TM , and are based on the thermally - induced Diels - Alder polymerization of 1,3 - divinyl - 1,1,3,3 ...
Page 35
... thermosetting polymer . The dielectric constant of PFCB at 2.35 is well below the range of competing polymer dielectrics . This feature makes PFCB an attractive dielectric for use as an interlayer dielectric ( ILD ) material . CH , CH ...
... thermosetting polymer . The dielectric constant of PFCB at 2.35 is well below the range of competing polymer dielectrics . This feature makes PFCB an attractive dielectric for use as an interlayer dielectric ( ILD ) material . CH , CH ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber