Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 26
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
THERMAL STABILITY Major challenges for using thin films of organic polymers are thermal stability , chemical stability , and mechanical properties . The choice of polymer lies in its ability to satisfy design and processing ...
Page 96
... thin films via supercritical processing , the solvent can Figure 8. Thin film evaporation rates at easily evaporate after deposition and before ambient temperature . gelation / drying if precautions are not taken . concept of spinning the ...
... thin films via supercritical processing , the solvent can Figure 8. Thin film evaporation rates at easily evaporate after deposition and before ambient temperature . gelation / drying if precautions are not taken . concept of spinning the ...
Page 165
... thin films ( a - C : F ) for use as low - dielectric - constant interlayer dielectrics were deposited by helicon - wave plasma - enhanced chemical vapor deposition using fluorocarbon compounds as a source material . The a - C : F films ...
... thin films ( a - C : F ) for use as low - dielectric - constant interlayer dielectrics were deposited by helicon - wave plasma - enhanced chemical vapor deposition using fluorocarbon compounds as a source material . The a - C : F films ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films