Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 40
... Transition metals to the right of the periodic table coordinate with fewer fluorine atoms and the reaction products possess significantly higher boiling or sublimation temperatures ; all of which are well above any temperature which ...
... Transition metals to the right of the periodic table coordinate with fewer fluorine atoms and the reaction products possess significantly higher boiling or sublimation temperatures ; all of which are well above any temperature which ...
Page 65
... transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and the ...
... transition temperatures Glass transition temperatures are important to judge a polymer's thermal behavior . At the glass transition , many properties may change abruptly . This includes the coefficient of thermal ex- pansion and the ...
Page 66
... transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 220 ...
... transition temperaturesa ) of the polymers 16 16d 16e 195 200 150 195 16c 16f 16g 16h 150 195 Table 6 : Glass transition temperaturesa ) of the polymers 16 ( continued ) Polymer No. Ta / ° C 16i 16i 16k 16m 16n 16p 16q 185 205 210 220 ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films