Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
From inside the book
Results 1-3 of 44
Page 6
... values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values measure for most other classes of organic polymers . There are ...
... values as high as their non - f on - fluorinated counterparts , with values in the 5-7 GPa range . These values are roughly two to three times higher than the values measure for most other classes of organic polymers . There are ...
Page 81
... values , which returned to their former values on evacuation . With the exception of PP ( C2F3H ) , which frequently short circuited above temperature , all other fluoropolymers showed permittivity values below 1.9 after vacuum ...
... values , which returned to their former values on evacuation . With the exception of PP ( C2F3H ) , which frequently short circuited above temperature , all other fluoropolymers showed permittivity values below 1.9 after vacuum ...
Page 92
... values were in the range of 0.0005 to 0.07 and a dramatic effect of adsorbed water on loss was noted ( no effort was made to passivate the surface ) . For silica density values less than 1 g / cm3 ( porosity > 55 % ) , the dielectric ...
... values were in the range of 0.0005 to 0.07 and a dramatic effect of adsorbed water on loss was noted ( no effort was made to passivate the surface ) . For silica density values less than 1 g / cm3 ( porosity > 55 % ) , the dielectric ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
23 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research a-C:F film adhesion ambient annealing applications as-deposited atoms BEOL capacitance chemical concentration crosslinking cure temperature cured films dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content Figure film thickness films deposited fluorine fluorocarbon fluoropolymers frequency FSG films FTIR glass transition temperature groups HDPCVD hydrogen imidization increasing integrated interface ISBN low dielectric constant low-k Materials Research Society measured metal moisture absorption monomers mtorr Multilevel Interconnection nanoporous nanoporous silica oxazole oxide Parylene Parylene AF-4 peak PECVD PFCB planarization polyimide polymerization polymers porosity precursor Proc properties PTFE ratio reaction refractive index resistance sample sccm semiconductor shows Si-F Si-O-Si SiDLC SiF4 silicon SiO2 SiOF films solvent spectra spin cast spin-coating stress structure substrate surface Symp thermal stability thin films ULSI vapor deposition wafer Wavenumber xerogel xerogel films