Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 15
... vapor deposited polyimide ( VDP ) films , using internal reflection infrared spectroscopy . The films were deposited directly on the internal reflection element . We find that spin cast films are more anisotropic than their VDP ...
... vapor deposited polyimide ( VDP ) films , using internal reflection infrared spectroscopy . The films were deposited directly on the internal reflection element . We find that spin cast films are more anisotropic than their VDP ...
Page 19
... vapor deposited films with the film orientation decreasing as the deposition rate increased . Since their highest ... vapor deposited PMDA - ODA polyimide films . In general , spin cast films were found to be more anisotropic than vapor ...
... vapor deposited films with the film orientation decreasing as the deposition rate increased . Since their highest ... vapor deposited PMDA - ODA polyimide films . In general , spin cast films were found to be more anisotropic than vapor ...
Page 21
... vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition characteristics , film composition and purity , thermal stability as well as preliminary electrical data . INTRODUCTION As gate widths ...
... vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition characteristics , film composition and purity , thermal stability as well as preliminary electrical data . INTRODUCTION As gate widths ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber