Low-dielectric Constant MaterialsMaterials Research Society, 1996 - Electric insulators and insulation |
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Page 15
... deposition method based on vapor deposition polymerization ( VDP ) allows formation of solventless films through vacuum coevaporation of a dianhydride and a diamine . 1,2 The resultant films are subsequently cured to form a polyimide ...
... deposition method based on vapor deposition polymerization ( VDP ) allows formation of solventless films through vacuum coevaporation of a dianhydride and a diamine . 1,2 The resultant films are subsequently cured to form a polyimide ...
Page 16
... Vapor Deposition of Polyimides Since the VDP deposition system has been described in detail elsewhere , we give here only a brief summary7 . The deposition system is a modified bell - jar vacuum evaporator with a three- sample rotating ...
... Vapor Deposition of Polyimides Since the VDP deposition system has been described in detail elsewhere , we give here only a brief summary7 . The deposition system is a modified bell - jar vacuum evaporator with a three- sample rotating ...
Page 21
... vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition characteristics , film composition and purity , thermal stability as well as preliminary electrical data . INTRODUCTION As gate widths ...
... vapor - deposition polymerization of tetrafluoro - p - xylylene . We present data on deposition characteristics , film composition and purity , thermal stability as well as preliminary electrical data . INTRODUCTION As gate widths ...
Contents
LowDielectric Constant Materials for IC Intermetal | 3 |
A Study of Anisotropy of Spin Cast and VaporDeposited | 15 |
A Low R Material Candidate for ULSI | 21 |
Copyright | |
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1997 Materials Research a-C:F film adhesion alloy ambient annealing as-deposited BEOL capacitance chemical chemical vapor deposition concentration crosslinking CTAC/TEOS cured dangling bonds decrease density deposition rate desorption dielectric constant DLC films electron ellipsometry etch rate evaporation F content FDLC Figure film thickness films deposited fluorine fluorocarbon FSG films FTIR glass transition temperature HDPCVD hydrogen imidization increasing integrated interface low dielectric constant low-k Materials Research Society measured metal moisture absorption mtorr Multilevel Interconnection nanoporous nanoporous silica O2 plasma oxide Parylene peak PECVD PFCB Phys planarization polyimide polymer pore porosity porous silica precursor Proc properties PTFE reaction reduced refractive index resistance rf power sample sccm semiconductor shows shrinkage Si-O-Si Si-OH Si-rich SiF4 silica films silicon SiO2 SiOF films SiOF layers Solid solvent spectra spin-coating stress structure surface Symp TEOS thermal stability thin films ULSI vapor deposition vibrational wafer Wavenumber