Microengineering Aerospace SystemsAnnotation Collects many of the ideas, fundamental principles, and technology rudiments that can profoundly change the manner by which aerospace systems are designed, engineered, and assembled. The concepts presented advance the use of microengineering principles to impart intelligence, volition, and motility to systems on the miniature scale, thereby effecting a change in the paradigm of how aerospace systems should be developed, maintained, and used. The 17 chapters cover the general areas of materials/mechanics/processing and packaging, microsystem devices, distributed system architectures, and satellite subsystems. The book is written in a tutorial style providing worked examples, key equations, and process sequences. Annotation c. Book News, Inc., Portland, OR (booknews.com). |
From inside the book
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Contents
Microengineering Space Systems | 29 |
Mechanical Analysis and Properties of MEMS Materials | 73 |
MEMS for Harsh Application Environments | 119 |
Laser Processing for Microengineering Applications | 145 |
Pros and Cons | 201 |
A Systems Approach to Microsystems Development | 227 |
Space Electronics Packaging Research and Engineering | 259 |
Micromachined Rate Gyroscopes | 347 |
Chemical Microsensors for Gas Detection and Applications to Space Systems | 449 |
Surface Micromachined Optical Systems | 485 |
Micropackaging HighDensity RadioFrequency Microwave Circuits | 519 |
MEMSBased Active Drag Reduction in Turbulent Boundary Layers | 553 |
Analysis Tools and Architecture Issues for Distributed Satellite Systems | 581 |
Propellants for Microspacecraft | 637 |
Micropropulsion Systems for Aircraft and Spacecraft | 657 |
697 | |
Common terms and phrases
accelerometers actuator Aerospace applications approach array assembly battery beam bulk micromachining capacitance cavity cell chemical chip circuit circuitry components cost density deposition detection devices dielectric distributed electrical electronics electrostatic elements energy etching example excimer laser fabrication frequency function gyroscope heat hydrazine IEEE increase integrated integrated circuit interconnect interface laser layer Li-ion mass material measured mechanical MEMS metal micro microelectromechanical systems Microengineering micromirror micropackage microsatellites microsystem mirror module monopropellant operation optical orbit output oxide packaging patterned performance photolithography planar plate polyimide polymer polysilicon pressure processor propellant propulsion pulse radiation reduce result rotation rotor satellite semiconductor sensitivity sensor nodes shear stress shown in Fig signal silicon SiO2 space systems spacecraft specific impulse stress structures substrate surface micromachining target techniques temperature thermal thickness Thin Films thruster tion transducer typically voltage wafer wavelength wire