Treatise on Materials Science and Technology, Volume 4 |
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Page 2
microstructure of the thin film . It is thus the aim of this chapter to consider the
more important methods used in the microstructural characterization of thin films .
Generally , emphasis will be given to those techniques which are usually readily
...
microstructure of the thin film . It is thus the aim of this chapter to consider the
more important methods used in the microstructural characterization of thin films .
Generally , emphasis will be given to those techniques which are usually readily
...
Page 3
A new and rapidly developing technique for measuring composition , interfacial
diffusion phenomena , film thickness and thickness variations , and depth
distribution of heavy atom impurities in thin or thick films is that of ion
backscattering ...
A new and rapidly developing technique for measuring composition , interfacial
diffusion phenomena , film thickness and thickness variations , and depth
distribution of heavy atom impurities in thin or thick films is that of ion
backscattering ...
Page 53
The accuracy of the integral breadth method for determining the particle size of
thin films has been verified for the case ... thin gold films 175 – 700 Å thick
equaled the film thickness when the crystallites extended from top to bottom in
the film .
The accuracy of the integral breadth method for determining the particle size of
thin films has been verified for the case ... thin gold films 175 – 700 Å thick
equaled the film thickness when the crystallites extended from top to bottom in
the film .
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Contents
RICHARD W VOOK | 2 |
Epitaxial Monocrystalline Films | 10 |
Polycrystalline Films | 37 |
Copyright | |
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activity addition alloys applied approximation average beam becomes calculated compaction component composition compression concentration considered constant copper correlation corresponding crystal cubic curve decreases defined deformation density dependence determined diffraction diffusion direction discussed dislocation disorder distribution effect electron elements energy enthalpy entropy equations example experimental expression factor fault field Figure forged function given gives increases influence interaction jump lattice material measurements mechanism metal method neighbor observed obtained occurs oriented parameter partial pattern phases Phys plane polycrystalline position possible powder present probability production properties random ratio reflections region relative respectively shown in Fig shows single crystals sintered solid solution solute atoms solvent strain strengthening stress structure Substituting surface Table temperature theoretical theory thermodynamic thin films tracer twin vacancy values variations volume X-ray yield