Microelectronic Interconnections and AssemblyGeorge G. Harman, Pavel Mach Contains 28 presentations and three abstracts from the May 1996 workshop, which was devoted to the technical aspects of advanced interconnections and micro-assembly, but also included papers on the education issues required to prepare students to work in these areas. Several papers predict the future directions of packaging and interconnection. Other papers discuss wire bonding and Tape Automated Bonding (TAB). In addition, the solder metallurgy as well as the production technology of flip chip interconnections are described. Multichip Module and thick-film hybrid substrate interconnections are also covered. Annotation copyrighted by Book News, Inc., Portland, OR |
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1998 Kluwer Academic adhesion aluminum anodisation applications ball bonds ceramic Chip Scale Package Chip Size Packages ChVS coatings components copper cost density deposited devices dielectric elastic modulus electrical electronic electroplating elongation equipment etching eutectic evaluation failure flip chip frequency function Harman heat hermetic packages high reliability IEEE increase industry integrated circuits Interconnections and Assembly Kluwer Academic Publishers laminate laser layer Mach eds manufacturing materials MCM-D measured mechanical metal Microelectronic Interconnections microelectronics miniaturisation mismatch multichip modules multilayer Nordic countries optical interconnects Optoelectronic Oxide parameters performance photoresist pitch plastic encapsulation plastic packaged plating polymers PQFP printed circuit board production reflow resistors sample semiconductor sensors silicon simulation solder bumps solder joints solution strain structure substrate surface mount switch techniques temperature thick film thin film TQFP wafer wire bonding