Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 264
... deposition of NiCrAIY and CoCrAIY materials . Successful confirmation of these preliminary results could lead to the CAPD method becoming a viable alternative to flame spraying for the deposition 264 PHILIP C. JOHNSON.
... deposition of NiCrAIY and CoCrAIY materials . Successful confirmation of these preliminary results could lead to the CAPD method becoming a viable alternative to flame spraying for the deposition 264 PHILIP C. JOHNSON.
Page 265
John L. Vossen, Werner Kern. becoming a viable alternative to flame spraying for the deposition of these materials onto aero - engine hot stage turbine blades . While the literature remains limited on the use of CAPD for alloy films ...
John L. Vossen, Werner Kern. becoming a viable alternative to flame spraying for the deposition of these materials onto aero - engine hot stage turbine blades . While the literature remains limited on the use of CAPD for alloy films ...
Page 272
John L. Vossen, Werner Kern. of MCrAIY normally applied by flame spraying or evaporation . Both of these techniques have their drawbacks ; in the case of plasma spraying , the finish is poor enough to require polishing to produce an ...
John L. Vossen, Werner Kern. of MCrAIY normally applied by flame spraying or evaporation . Both of these techniques have their drawbacks ; in the case of plasma spraying , the finish is poor enough to require polishing to produce an ...
Contents
Rossnagel | 12 |
A Plasma Potential | 14 |
B Floating Potential C Sheaths | 15 |
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alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD sample semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength