Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 91
... heater Freely wets Chromel and Cb . Ni , Fe , Fe - crucible Nichrome conical basket Carbon 3700 ± 100 2,681 heater Pointed carbon rods pressed Resistance heating together forming high resistance contact Cerium 785 1,305 Chromium 1,900 ...
... heater Freely wets Chromel and Cb . Ni , Fe , Fe - crucible Nichrome conical basket Carbon 3700 ± 100 2,681 heater Pointed carbon rods pressed Resistance heating together forming high resistance contact Cerium 785 1,305 Chromium 1,900 ...
Page 93
... heater Magnesium 651 443 ( sublimes ) W , Ni , Fe , Ta , Mo Ta Iron crucible ; External Mo , Cb , carbon Nichrome Chromel , heater conical Resistance heater Embedded basket Manganese 1,244 980 W , Ta , Mo , Alumina crucible Cb , conical ...
... heater Magnesium 651 443 ( sublimes ) W , Ni , Fe , Ta , Mo Ta Iron crucible ; External Mo , Cb , carbon Nichrome Chromel , heater conical Resistance heater Embedded basket Manganese 1,244 980 W , Ta , Mo , Alumina crucible Cb , conical ...
Page 94
... heater or basket radiant heater Remarks Very volatile , may contaminate plant . Wets filament metals quoted . basket Strontium 771 549 W , Ta , Mo , Carbon Cb , conical basket Resistance- heated Freely wets without alloying with all ...
... heater or basket radiant heater Remarks Very volatile , may contaminate plant . Wets filament metals quoted . basket Strontium 771 549 W , Ta , Mo , Carbon Cb , conical basket Resistance- heated Freely wets without alloying with all ...
Contents
Rossnagel | 12 |
A Plasma Potential | 14 |
B Floating Potential C Sheaths | 15 |
49 other sections not shown
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Common terms and phrases
alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD sample semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength