Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
From inside the book
Results 1-2 of 2
Page 726
... polymer residue on the Si surface . Applying a magnetic field to a glow discharge influences the etch rate of a ... deposition and etching in recent years . Their electrodeless nature , coupled with the possibility of creating large ...
... polymer residue on the Si surface . Applying a magnetic field to a glow discharge influences the etch rate of a ... deposition and etching in recent years . Their electrodeless nature , coupled with the possibility of creating large ...
Page 824
... polymers almost always leave debris on the surface around the etched feature . In the single - shot removal of metal films , debris on adjacent areas consistent with ejection of molten material is observed [ 29 ] . Debris deposition can ...
... polymers almost always leave debris on the surface around the etched feature . In the single - shot removal of metal films , debris on adjacent areas consistent with ejection of molten material is observed [ 29 ] . Debris deposition can ...
Contents
Rossnagel | 12 |
A Plasma Potential | 14 |
B Floating Potential C Sheaths | 15 |
49 other sections not shown
Other editions - View all
Common terms and phrases
alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD sample semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength