Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 5
John L. Vossen, Werner Kern. TABLE I OTHER THIN FILM BOOKS AND REFERENCES TO PROCESSES NOT COVERED IN THIS BOOK Topic References Thin film deposition and etching books published after 1977 Techniques for preparing substrates for film ...
John L. Vossen, Werner Kern. TABLE I OTHER THIN FILM BOOKS AND REFERENCES TO PROCESSES NOT COVERED IN THIS BOOK Topic References Thin film deposition and etching books published after 1977 Techniques for preparing substrates for film ...
Page 204
... thin films will involve an integration of many different types of processes into more and more complex deposition systems . Sputtering will continue to play a very important role . REFERENCES 1. L. I. Maissel , in " Physics of Thin Films ...
... thin films will involve an integration of many different types of processes into more and more complex deposition systems . Sputtering will continue to play a very important role . REFERENCES 1. L. I. Maissel , in " Physics of Thin Films ...
Page 255
... thin surface layer of high- melting - point nitride or oxide . The presence of such a layer reduces the emission of microdroplets because of both the high melting temperature of the compound and the ... THIN FILMS 255 Thin Film Deposition.
... thin surface layer of high- melting - point nitride or oxide . The presence of such a layer reduces the emission of microdroplets because of both the high melting temperature of the compound and the ... THIN FILMS 255 Thin Film Deposition.
Contents
Rossnagel | 12 |
A Plasma Potential | 14 |
B Floating Potential C Sheaths | 15 |
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alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD sample semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength