Thin Film Processes, Volume 2John L. Vossen, Werner Kern Academic Press, 1978 - Thin films |
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Page 4
... vapor deposition . It provides an update to a similar chapter in the first volume . Chapter III.2 and III.3 review two special subsets of chemical vapor deposition : Chapter III.2 covers metal organic CVD , which is gaining popularity ...
... vapor deposition . It provides an update to a similar chapter in the first volume . Chapter III.2 and III.3 review two special subsets of chemical vapor deposition : Chapter III.2 covers metal organic CVD , which is gaining popularity ...
Page 231
... Vapor Metal lons Metal lons Microdroplets A. The Vapor Stream Following investigation of the pressure exerted on the cathode by the vapor stream of a vacuum arc , both Tanberg [ 78 ] and Easton et al . [ 79 ] concluded that the energy ...
... Vapor Metal lons Metal lons Microdroplets A. The Vapor Stream Following investigation of the pressure exerted on the cathode by the vapor stream of a vacuum arc , both Tanberg [ 78 ] and Easton et al . [ 79 ] concluded that the energy ...
Page 378
... vapor pressure is often only given at one temperature and pressure . The measurement of vapor pressures for organo- metallic compounds is described by Kayser et al . [ 32 ] . The vapor pres- sure is sensitive to the presence of ...
... vapor pressure is often only given at one temperature and pressure . The measurement of vapor pressures for organo- metallic compounds is described by Kayser et al . [ 32 ] . The vapor pres- sure is sensitive to the presence of ...
Contents
Rossnagel | 12 |
A Plasma Potential | 14 |
B Floating Potential C Sheaths | 15 |
49 other sections not shown
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Common terms and phrases
alloy anode Appl applications AsH3 atoms cathode chamber chemical chemical vapor deposition coatings composition compound Crystal Growth density deposition rate device dielectric dopant doping effects Electrochem emission epitaxial etch rate evaporation film deposition flow flux GaAs gas-phase gases glow discharge grid growth rate heater heating increase ion beam ion bombardment ion energy ion source ionization kinetic laser layer Lett LPCVD magnetic field magnetron material metal molecules nitride OMVPE optical oxide particle PECVD photochemical photodeposition photon photoresist Phys plasma plasma etching potential precursor pressure Proc produce pump ratio reactants reaction reactor refractory metal region remote PECVD sample semiconductor shown in Fig SiH4 silane silicon silicon nitride SiO2 sol-gel species sputter deposition sputtering stoichiometric substrate substrate temperature surface susceptor target techniques Technol thermal thickness thin film Thin Solid Films tion torr typically vacuum voltage wafer wavelength