Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
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Page 48
... reduction of salt solution by a reducing agent . The silver is produced from its aqueous salt like silver nitrate or from silver oxide by means of organic reducing agents like sugar , alcohol or aldehyde or inorganic reducing 48 ...
... reduction of salt solution by a reducing agent . The silver is produced from its aqueous salt like silver nitrate or from silver oxide by means of organic reducing agents like sugar , alcohol or aldehyde or inorganic reducing 48 ...
Page 49
... reducing agents like hydrazine , potassium sulphate or sodium formate . Powders so produced have good flow rate and sinterability and are less than 20 micron in diameter . These fine powders have a very high tendency to agglomeration ...
... reducing agents like hydrazine , potassium sulphate or sodium formate . Powders so produced have good flow rate and sinterability and are less than 20 micron in diameter . These fine powders have a very high tendency to agglomeration ...
Page 275
... reduction of metal ions to metal atoms by the simultaneous oxidation of reducing agent such as formaldehyde or hypophosphorous acid . The electrons necessary for reduction of depositing metal are supplied by the reducing agent . e.g. ...
... reduction of metal ions to metal atoms by the simultaneous oxidation of reducing agent such as formaldehyde or hypophosphorous acid . The electrons necessary for reduction of depositing metal are supplied by the reducing agent . e.g. ...
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Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum vapor voltage wafer wave soldering welding wire wire bonding X-ray