Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
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Page 57
... structure . Randomly oriented lamellar structure is developed because of repeated fracturing and rewelding of layered composites . The thickness of the lamellae decreases and the diffusion distance also reduces to a few microns level ...
... structure . Randomly oriented lamellar structure is developed because of repeated fracturing and rewelding of layered composites . The thickness of the lamellae decreases and the diffusion distance also reduces to a few microns level ...
Page 318
... structural integrity of tin [ 9.2 ] . The ẞ - tin has a tetragonal crystal structure with relatively higher packing density , whereas the diamond cubic crystal structure of a - tin is rather an open structure . Thus tin pest can be a ...
... structural integrity of tin [ 9.2 ] . The ẞ - tin has a tetragonal crystal structure with relatively higher packing density , whereas the diamond cubic crystal structure of a - tin is rather an open structure . Thus tin pest can be a ...
Page 327
... structure . The eutectic structure consists of 87 % B - phase , which is soft whereas the tin - rich v - phase is relatively hard . Temperature ( deg . C ) 250 232 ° C 225 Liquid 200 8 175 156 ° C 150 α 125 Y 120 117 ° C 50.9 В 75 50 25 ...
... structure . The eutectic structure consists of 87 % B - phase , which is soft whereas the tin - rich v - phase is relatively hard . Temperature ( deg . C ) 250 232 ° C 225 Liquid 200 8 175 156 ° C 150 α 125 Y 120 117 ° C 50.9 В 75 50 25 ...
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Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum vapor voltage wafer wave soldering welding wire wire bonding X-ray