Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 74
... 1995 , pp129- 135 . 2. P.W.Lee , S.Mizuno , Amrita Verma , H.Tran , and B.Nguyen J.Electrochem . Soc . , Vol . 143 ... Materials , Osaka , 1995 , pp 602-604 . 4. T.Homma , Proceedings of Materials Research Society Symposium , San ...
... 1995 , pp129- 135 . 2. P.W.Lee , S.Mizuno , Amrita Verma , H.Tran , and B.Nguyen J.Electrochem . Soc . , Vol . 143 ... Materials , Osaka , 1995 , pp 602-604 . 4. T.Homma , Proceedings of Materials Research Society Symposium , San ...
Page 247
... ( 1995 ) . 2. C. H. Ting , J. Leu , J. K. Lee , J. Kasthurirangan , C. N. Liao , and P. S. Ho in Advanced Metalization for ULSI Application in 1994 , Ed . R. Blumenthal and G. Janssen ( Materials Research Society , Pittsburgh , PA , 1995 ) ...
... ( 1995 ) . 2. C. H. Ting , J. Leu , J. K. Lee , J. Kasthurirangan , C. N. Liao , and P. S. Ho in Advanced Metalization for ULSI Application in 1994 , Ed . R. Blumenthal and G. Janssen ( Materials Research Society , Pittsburgh , PA , 1995 ) ...
Page 248
... 1995 , Ed . R. C. Ellwanger and Shi - Qing Wang ( Materials Research Society , Pittsburgh , PA , 1996 ) , pp . 81-88 . 14. H. Kitoh , M. Muroyama , M. Sasaki , M. Iwasawa , Jpn . J. App . Phys . , vol 35 , pp . 1464-1467 , ( 1996 ) . 15 ...
... 1995 , Ed . R. C. Ellwanger and Shi - Qing Wang ( Materials Research Society , Pittsburgh , PA , 1996 ) , pp . 81-88 . 14. H. Kitoh , M. Muroyama , M. Sasaki , M. Iwasawa , Jpn . J. App . Phys . , vol 35 , pp . 1464-1467 , ( 1996 ) . 15 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch