Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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... 1997 by Materials Research Society . All rights reserved . This book has been registered with Copyright Clearance ... Materials Research Society 506 Keystone Drive Warrendale , PA 15086 Telephone ( 412 ) 779-3003 Fax ( 412 ) 779-8313 ...
... 1997 by Materials Research Society . All rights reserved . This book has been registered with Copyright Clearance ... Materials Research Society 506 Keystone Drive Warrendale , PA 15086 Telephone ( 412 ) 779-3003 Fax ( 412 ) 779-8313 ...
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MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 438- Materials Modification and Synthesis by Ion Beam Processing , D.E. Alexander , N.W. Cheung , B. Park , W. Skorupa , 1997 ... 1997 , ISBN : 1-55899-343-6 Volume 440- Structure and ...
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 438- Materials Modification and Synthesis by Ion Beam Processing , D.E. Alexander , N.W. Cheung , B. Park , W. Skorupa , 1997 ... 1997 , ISBN : 1-55899-343-6 Volume 440- Structure and ...
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MATERIALS Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 460— High - Temperature Ordered Intermetallic Alloys VII , C.C. Koch , C.T. Liu , N.S. Stoloff , A. Wanner , 1997 ... 1997 , ISBN : 1-55899-365-7 Volume 462- Materials Issues in Art and ...
MATERIALS Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 460— High - Temperature Ordered Intermetallic Alloys VII , C.C. Koch , C.T. Liu , N.S. Stoloff , A. Wanner , 1997 ... 1997 , ISBN : 1-55899-365-7 Volume 462- Materials Issues in Art and ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch