Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 47
Page 22
... annealing at 350 ° C , which is higher than the temperature of thermal stability of a - C : F at 300 ° C [ 5 ] . In ... annealed in oxygen plasma ambient at 150 ° C . Figure 3 ( c ) shows the optical view after oxygen plasma annealing ...
... annealing at 350 ° C , which is higher than the temperature of thermal stability of a - C : F at 300 ° C [ 5 ] . In ... annealed in oxygen plasma ambient at 150 ° C . Figure 3 ( c ) shows the optical view after oxygen plasma annealing ...
Page 176
... Annealed 400 ° C Annealed CTE ( ppm / ° C ) Bi - axial modulus ( GPa ) 1.3 15.6 15.3 2.6 6.0 81 12.5 9.5 180 124 CONCLUSIONS Bending beam measurements with dual substrates were employed to derive the linear co- efficient of thermal ...
... Annealed 400 ° C Annealed CTE ( ppm / ° C ) Bi - axial modulus ( GPa ) 1.3 15.6 15.3 2.6 6.0 81 12.5 9.5 180 124 CONCLUSIONS Bending beam measurements with dual substrates were employed to derive the linear co- efficient of thermal ...
Page 227
... annealing to 250 ° C for several anneal times . The a peak does not grow during the 250 ° C anneal as it did in the 200 ° C anneal , but a large ẞ peak grows in both ... annealed film properties . The result indicates that the properties 227.
... annealing to 250 ° C for several anneal times . The a peak does not grow during the 250 ° C anneal as it did in the 200 ° C anneal , but a large ẞ peak grows in both ... annealed film properties . The result indicates that the properties 227.
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch