Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 8
Page 52
... Chemat - B occured in the first 5 minutes , and converted to a stable material under that condition . Heat treatment of Chemat - B coatings in different atmospheres at different temperatures with different heating profiles were ...
... Chemat - B occured in the first 5 minutes , and converted to a stable material under that condition . Heat treatment of Chemat - B coatings in different atmospheres at different temperatures with different heating profiles were ...
Page 53
... chemical compositions of the coatings . Table 1 Thickness , Refractive Index and Dielectric Constant of Chemat - B Coatings Auger Ellipsometer Refractive Sample Thickness , Å Thickness , Å Index Dielectric Const . , Dielectric Const . 1 ...
... chemical compositions of the coatings . Table 1 Thickness , Refractive Index and Dielectric Constant of Chemat - B Coatings Auger Ellipsometer Refractive Sample Thickness , Å Thickness , Å Index Dielectric Const . , Dielectric Const . 1 ...
Page 56
... Chemat - B polymer for VLSI multilevel interconnections , which provides many advantages compared to traditional organic or inorganic low - k materials . Chemat - B solution can be deposited by spin - on processing . By a low ...
... Chemat - B polymer for VLSI multilevel interconnections , which provides many advantages compared to traditional organic or inorganic low - k materials . Chemat - B solution can be deposited by spin - on processing . By a low ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch