Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 36
Page 82
... DISCUSSION 1. Interface characteristics Adhesion Figure 1 shows the adhesion strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi films have significantly large critical loads compared to those of pure Cu films ...
... DISCUSSION 1. Interface characteristics Adhesion Figure 1 shows the adhesion strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi films have significantly large critical loads compared to those of pure Cu films ...
Page 233
... H36B hipot tester . Measurements where taken at four separate points on the wafer . Five wafers of each type were used . The mean of the twenty readings is reported . RESULTS AND DISCUSSION Adhesion Stud pull test results are presented 233.
... H36B hipot tester . Measurements where taken at four separate points on the wafer . Five wafers of each type were used . The mean of the twenty readings is reported . RESULTS AND DISCUSSION Adhesion Stud pull test results are presented 233.
Page 280
... DISCUSSION Effect of RI and Stress On Wet Etch Rate . The quality of FSG films deposited on the sidewall of a feature is not necessarily the same as that on the top surface . Previous work has shown that FSG films can be subject to ...
... DISCUSSION Effect of RI and Stress On Wet Etch Rate . The quality of FSG films deposited on the sidewall of a feature is not necessarily the same as that on the top surface . Previous work has shown that FSG films can be subject to ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch