Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 263
... F Concentration ( 1 / cc ) 7.0x1020 Ti Oxide 6.0x1020 5.0x1020 4.0x1020 3.0x1020 2.0x1020 1 : 1.0x1020 0.0 0.04 0.06 ... content inside the Ti films ( see Fig . 1 ) . Unlike a normal diffusion profile , the F concentration in the Ti ...
... F Concentration ( 1 / cc ) 7.0x1020 Ti Oxide 6.0x1020 5.0x1020 4.0x1020 3.0x1020 2.0x1020 1 : 1.0x1020 0.0 0.04 0.06 ... content inside the Ti films ( see Fig . 1 ) . Unlike a normal diffusion profile , the F concentration in the Ti ...
Page 278
... F atom for one O atom is insufficient to account for the relatively large ... content . However , to be more quantitative , two additional factors must be ... F also contributes a factor of ~ 0.2 [ 4 ] . Combining these terms then ...
... F atom for one O atom is insufficient to account for the relatively large ... content . However , to be more quantitative , two additional factors must be ... F also contributes a factor of ~ 0.2 [ 4 ] . Combining these terms then ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch