Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page vi
... Films Metallized on Polyimide E. Kondoh and T.P. Nguyen * Recent Advances in Low - k Polymeric Materials K.R. Carter ... Fox , and Huei - Min Ho Effects of Electron - Beam Exposure on Poly ( Arylene Ether ) Dielectric Films ...... J.S. ...
... Films Metallized on Polyimide E. Kondoh and T.P. Nguyen * Recent Advances in Low - k Polymeric Materials K.R. Carter ... Fox , and Huei - Min Ho Effects of Electron - Beam Exposure on Poly ( Arylene Ether ) Dielectric Films ...... J.S. ...
Page 173
... films are deduced by means of wafer curvature measurement . The same ... film mechanical properties in a thickness regime typi- cally ecountered in IC ... ( FOX - 15 ) was spin - coated on 3 inch Si ( 250 μmthick ) and GaAs ( 650 ...
... films are deduced by means of wafer curvature measurement . The same ... film mechanical properties in a thickness regime typi- cally ecountered in IC ... ( FOX - 15 ) was spin - coated on 3 inch Si ( 250 μmthick ) and GaAs ( 650 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch