Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 34
... FTIR absorbance spectra after normalizing them with respect to film thickness . Figure 7 shows normalized FTIR spectra of a -40V bias 1.5 F : H film before and after 60 minutes at 400 ° C . The spectra do not change much after 15 ...
... FTIR absorbance spectra after normalizing them with respect to film thickness . Figure 7 shows normalized FTIR spectra of a -40V bias 1.5 F : H film before and after 60 minutes at 400 ° C . The spectra do not change much after 15 ...
Page 39
... FTIR characterization , a ratio of the cured SiH peak area per film thickness to a hot plate baked film was quantified to determine normalized SiH bond density . Silanol concentration was determined by a method described elsewhere ...
... FTIR characterization , a ratio of the cured SiH peak area per film thickness to a hot plate baked film was quantified to determine normalized SiH bond density . Silanol concentration was determined by a method described elsewhere ...
Page 107
... FTIR spectra also indicate the removal of organic groups due to the cure . FTIR for Uncured , Cured Films Absorbance 4400 3600 2800 2000 Wavenumber ( cm - 1 ) 1200 400 Figure 1. Fourier - transform infrared spectra of an uncured ...
... FTIR spectra also indicate the removal of organic groups due to the cure . FTIR for Uncured , Cured Films Absorbance 4400 3600 2800 2000 Wavenumber ( cm - 1 ) 1200 400 Figure 1. Fourier - transform infrared spectra of an uncured ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch