Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 22
... Figure 3 ( a ) shows an optical view after annealing at 350 ° C without oxygen plasma , The reduction of a - C : F ... ( figure 3 ( a ) ) after planarization by CMP is shown in figure 3 ( b ) . The void failure after CMP ( figure 3 ( b ) ...
... Figure 3 ( a ) shows an optical view after annealing at 350 ° C without oxygen plasma , The reduction of a - C : F ... ( figure 3 ( a ) ) after planarization by CMP is shown in figure 3 ( b ) . The void failure after CMP ( figure 3 ( b ) ...
Page 33
... Figure 4 : Loss tangent at 105 Hz as a function of a thermal soak at 400 ° C in 4 Torr Ar . The growth conditions were -50V bias , and a 1.5 F : H gas mixture . of thermal cycling . Figure 3 shows the effect on dielectric constant . The ...
... Figure 4 : Loss tangent at 105 Hz as a function of a thermal soak at 400 ° C in 4 Torr Ar . The growth conditions were -50V bias , and a 1.5 F : H gas mixture . of thermal cycling . Figure 3 shows the effect on dielectric constant . The ...
Page 109
... Figure 6a . This confirms that water is evolved during curing . Furthermore , desorption of methyl alcohol was also found to occur at 130 C ( Figure 6b ) . Figure 6a . Abundance lon 18 70000 60000 50000 40000 30000 20000 10000 Time ...
... Figure 6a . This confirms that water is evolved during curing . Furthermore , desorption of methyl alcohol was also found to occur at 130 C ( Figure 6b ) . Figure 6a . Abundance lon 18 70000 60000 50000 40000 30000 20000 10000 Time ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch