Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 24
... IEEE IEDM , p.261 , ( 1993 ) . [ 2 ] K. Endo and T. Tatsumi , J. Appl . Phys . 78 , p . 1370 , ( 1995 ) . [ 3 ] Y. Matsubara et al . , Tech . Digest IEEE IEDM , p.369 , ( 1996 ) . [ 4 ] R. R. Uttrcht et al . , Proc . of IEEE VMIC , p.20 ...
... IEEE IEDM , p.261 , ( 1993 ) . [ 2 ] K. Endo and T. Tatsumi , J. Appl . Phys . 78 , p . 1370 , ( 1995 ) . [ 3 ] Y. Matsubara et al . , Tech . Digest IEEE IEDM , p.369 , ( 1996 ) . [ 4 ] R. R. Uttrcht et al . , Proc . of IEEE VMIC , p.20 ...
Page 134
... IEEE Circuits and Devices 11 ( 1 ) , 16-21 ( 1995 ) . [ 3 ] K.C. Saraswat and F. Mohammadi , IEEE Trans . Electron Devices ED - 29 ( 4 ) , 645-650 ( 1982 ) . [ 4 ] J. Ida , M. Yoshimaru , T. Usami , A. Ohtomo , K. Shimokawa , A. Kita ...
... IEEE Circuits and Devices 11 ( 1 ) , 16-21 ( 1995 ) . [ 3 ] K.C. Saraswat and F. Mohammadi , IEEE Trans . Electron Devices ED - 29 ( 4 ) , 645-650 ( 1982 ) . [ 4 ] J. Ida , M. Yoshimaru , T. Usami , A. Ohtomo , K. Shimokawa , A. Kita ...
Page 248
... IEEE DUMIC , pp 287-294 , ( 1996 ) . 13. N. Hayasaka , H Miyajima , H. Nakasaki , and R. Katsumata in Advanced Metalization for ULSI Application in 1995 , Ed . R. C. Ellwanger and Shi - Qing Wang ( Materials Research Society ...
... IEEE DUMIC , pp 287-294 , ( 1996 ) . 13. N. Hayasaka , H Miyajima , H. Nakasaki , and R. Katsumata in Advanced Metalization for ULSI Application in 1995 , Ed . R. C. Ellwanger and Shi - Qing Wang ( Materials Research Society ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch