Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 161
... N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ... ( PA - N ) films after chemical - mechanical polishing ( CMP ) is influenced by 3 factors : slurry composition , quality of ...
... N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ... ( PA - N ) films after chemical - mechanical polishing ( CMP ) is influenced by 3 factors : slurry composition , quality of ...
Page 162
In this paper , the surface qualities of BCB and PA - N films after CMP are compared . The difference between BCB polishing and PA - N polishing is due to their different chemical structures . EXPERIMENT - Parylene - N films were vapor ...
In this paper , the surface qualities of BCB and PA - N films after CMP are compared . The difference between BCB polishing and PA - N polishing is due to their different chemical structures . EXPERIMENT - Parylene - N films were vapor ...
Page 163
... film and the influence of polishing time on surface characteristics . A. The influence of the slurry The selection ... PA - N film and BCB films , several slurries were used as given in Table I. Both nitric and ammonium hydroxide based ...
... film and the influence of polishing time on surface characteristics . A. The influence of the slurry The selection ... PA - N film and BCB films , several slurries were used as given in Table I. Both nitric and ammonium hydroxide based ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch