Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 9
Page 62
... [ PTFE ] and 2,2 - bis ( trifluoromethyl ) -4,5 difluoro - 1,3 dioxole . The dioxole group is added to improve the mechanical properties of PTFE for ULSI applications , and the structure is as shown in Figure 1 . F F F.C 3 C CF 3 8 ...
... [ PTFE ] and 2,2 - bis ( trifluoromethyl ) -4,5 difluoro - 1,3 dioxole . The dioxole group is added to improve the mechanical properties of PTFE for ULSI applications , and the structure is as shown in Figure 1 . F F F.C 3 C CF 3 8 ...
Page 232
... PTFE Thin Films Breakdown Field Strength : Current Leakage Density : Mechanical Properties : 1.7 to 2.0 ( isotropic ) ... PTFE dispersions were also applied using the spin coater . All 6 wafers were spun for 10 seconds at 50 rpm to allow a ...
... PTFE Thin Films Breakdown Field Strength : Current Leakage Density : Mechanical Properties : 1.7 to 2.0 ( isotropic ) ... PTFE dispersions were also applied using the spin coater . All 6 wafers were spun for 10 seconds at 50 rpm to allow a ...
Page 235
... PTFE may be suitable for use without requiring a separate dielectric liner . Since the dielectric liner materials typically have a minimum dielectric constant of 4.0 ( SiO2 ) , use of a liner significantly increases the effective ...
... PTFE may be suitable for use without requiring a separate dielectric liner . Since the dielectric liner materials typically have a minimum dielectric constant of 4.0 ( SiO2 ) , use of a liner significantly increases the effective ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch