Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 197
... Parylene - N has been incorporated into both aluminum - 1 and copper - 2 based metallization schemes , however , improvements in the adhesion and thermal stability are still needed to simplify and increase the robustness of the ...
... Parylene - N has been incorporated into both aluminum - 1 and copper - 2 based metallization schemes , however , improvements in the adhesion and thermal stability are still needed to simplify and increase the robustness of the ...
Page 199
... Parylene - N is loaded into the sublimator just below the cracking furnace . After the dimer sublimates it passes into the furnace where the reactive monomer is created by cracking or thermal cleaving from the stable dimer at around 700 ...
... Parylene - N is loaded into the sublimator just below the cracking furnace . After the dimer sublimates it passes into the furnace where the reactive monomer is created by cracking or thermal cleaving from the stable dimer at around 700 ...
Page 219
CHARACTERIZATION OF PARYLENE - N THIN FILMS FOR LOW - K VLSI APPLICATIONS STEVEN C. SELBREDE , MARTIN L. ZUCKER Mattson Technology , Inc. , 3550 W. Warren Avenue , Fremont , CA , 94538 ABSTRACT Parylene - N thin films were characterized ...
CHARACTERIZATION OF PARYLENE - N THIN FILMS FOR LOW - K VLSI APPLICATIONS STEVEN C. SELBREDE , MARTIN L. ZUCKER Mattson Technology , Inc. , 3550 W. Warren Avenue , Fremont , CA , 94538 ABSTRACT Parylene - N thin films were characterized ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch