Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 36
... Phys . Lett . , 60 , 2089 ( 1992 ) . [ 8 ] K. Endo , and T. Tatsumi , Appl . Phys . Lett . , 68 , 2864 ( 1996 ) . [ 9 ] J. A. Tobin , G. Li , L. T. Mahoney , D. D. Denton , and J. L. Shohet , presented at the 39th AVS National Symposium ...
... Phys . Lett . , 60 , 2089 ( 1992 ) . [ 8 ] K. Endo , and T. Tatsumi , Appl . Phys . Lett . , 68 , 2864 ( 1996 ) . [ 9 ] J. A. Tobin , G. Li , L. T. Mahoney , D. D. Denton , and J. L. Shohet , presented at the 39th AVS National Symposium ...
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... Phys . 75 , 3627 ( 1994 ) . [ 5 ] D.B. Knorr , and K.P. Rodbell , J. Appl . Phys . 79 , 2409 ( 1996 ) . [ 6 ] N. Inagaki , S. Tasaka , and K. Hibi , J. Adhesion Sci . Technol . 8 , 395 ( 1994 ) . [ 7 ] K.W. Paik , A.L. Ruoff , in ...
... Phys . 75 , 3627 ( 1994 ) . [ 5 ] D.B. Knorr , and K.P. Rodbell , J. Appl . Phys . 79 , 2409 ( 1996 ) . [ 6 ] N. Inagaki , S. Tasaka , and K. Hibi , J. Adhesion Sci . Technol . 8 , 395 ( 1994 ) . [ 7 ] K.W. Paik , A.L. Ruoff , in ...
Page 260
... Phys . , 56 ( 1984 ) 2639 . [ 9 ] W.R. Hoffman , in Physics of Thin Film , ed . by G. Hass and R.E. Thun , vol 3 , p211 , Academic , New York , 1966 . [ 10 ] R.J. Jaccodine and W.A. Schlegel , J. Appl . Phys , 37 ( 1966 ) 2429 . [ 11 ] ...
... Phys . , 56 ( 1984 ) 2639 . [ 9 ] W.R. Hoffman , in Physics of Thin Film , ed . by G. Hass and R.E. Thun , vol 3 , p211 , Academic , New York , 1966 . [ 10 ] R.J. Jaccodine and W.A. Schlegel , J. Appl . Phys , 37 ( 1966 ) 2429 . [ 11 ] ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch