Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 161
... Rensselaer Polytechnic Institute , Troy , NY 12180 * Department of Physics , Applied Physics , and Astronomy ** Department of Electrical , Computer , and Systems Engineering *** Department of Materials Science and Engineering ABSTRACT ...
... Rensselaer Polytechnic Institute , Troy , NY 12180 * Department of Physics , Applied Physics , and Astronomy ** Department of Electrical , Computer , and Systems Engineering *** Department of Materials Science and Engineering ABSTRACT ...
Page 230
... Rensselaer Polytechnic Institute , Troy , NY , Aug. 9-10 , 1994 . J. Wary , R. Olson , and W. Beach , Semicond . Int . ( June ) , 211 ( 1996 ) . D.E. Kirkpatrich and W. Wunderlich , J. Polym . Sci . Polym . Phys . Ed . 24 , 931 ( 1986 ) ...
... Rensselaer Polytechnic Institute , Troy , NY , Aug. 9-10 , 1994 . J. Wary , R. Olson , and W. Beach , Semicond . Int . ( June ) , 211 ( 1996 ) . D.E. Kirkpatrich and W. Wunderlich , J. Polym . Sci . Polym . Phys . Ed . 24 , 931 ( 1986 ) ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch