Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page xi
MATERIALS Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 460— High - Temperature Ordered Intermetallic Alloys VII ... Research Society Symposium Proceedings available by contacting Materials Research Society Part I Organic and Inorganic ...
MATERIALS Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 460— High - Temperature Ordered Intermetallic Alloys VII ... Research Society Symposium Proceedings available by contacting Materials Research Society Part I Organic and Inorganic ...
Page 155
... research relates to a methodology for in - situ monitoring of the low - k dielectric material CMP planarization process , specifically for monitoring material removal rate and scratch occurrence , using acoustic emission ( AE ) sensing ...
... research relates to a methodology for in - situ monitoring of the low - k dielectric material CMP planarization process , specifically for monitoring material removal rate and scratch occurrence , using acoustic emission ( AE ) sensing ...
Page 161
... research has concentrated on metals or silicon oxide ( SiO2 ) [ 3-8 ] , with only preliminary results for polymers to - date [ 9,10,11 ] . Polymers are candidates for interlayer dielectrics ( ILDs ) because of their low dielectric ...
... research has concentrated on metals or silicon oxide ( SiO2 ) [ 3-8 ] , with only preliminary results for polymers to - date [ 9,10,11 ] . Polymers are candidates for interlayer dielectrics ( ILDs ) because of their low dielectric ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch