Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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... Center , Inc . For further information , please contact the Copyright Clearance
Center , Salem , Massachusetts . Published by : Materials Research Society 506
Keystone Drive Warrendale , PA 15086 Telephone ( 412 ) 779 - 3003 Fax ( 412 )
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Page 17
The authors would also like to thank Victor White of the University of Wisconsin
for measurements of moisture uptake . - o REFERENCES P . H . Townsend , B . S
. Huber , and D . S . Wang , Proceedings of the Materials Research Society 239 ...
The authors would also like to thank Victor White of the University of Wisconsin
for measurements of moisture uptake . - o REFERENCES P . H . Townsend , B . S
. Huber , and D . S . Wang , Proceedings of the Materials Research Society 239 ...
Page 155
This research relates to a methodology for in - situ monitoring of the low - k
dielectric material CMP planarization process , specifically for monitoring material
removal rate and scratch occurrence , using acoustic emission ( AE ) sensing ...
This research relates to a methodology for in - situ monitoring of the low - k
dielectric material CMP planarization process , specifically for monitoring material
removal rate and scratch occurrence , using acoustic emission ( AE ) sensing ...
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Contents
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
INTERFACES AND POROUS MATERIALS | 59 |
Copyright | |
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addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode moisture observed obtained occurs oxide oxygen PA-N passivation peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer