Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 45
... SOG etchback was studied using Applied Materials ' 200mm MxP + etch chamber on Allied Signal's SOG ( spin - on - glass ) T11 and low к SOP ( spin - on - polymer ) 418 together with liner films of PE - oxide and oxynitride for IMD ...
... SOG etchback was studied using Applied Materials ' 200mm MxP + etch chamber on Allied Signal's SOG ( spin - on - glass ) T11 and low к SOP ( spin - on - polymer ) 418 together with liner films of PE - oxide and oxynitride for IMD ...
Page 46
... SOG T11 and SOP 418 in organic content has a direct impact on the etch rate and selectivity . In this study , the spin - on films were cured in nitrogen at 425 ° C and oxide films are all TEOS USG ( Undoped Silicon Glass ) . Film ...
... SOG T11 and SOP 418 in organic content has a direct impact on the etch rate and selectivity . In this study , the spin - on films were cured in nitrogen at 425 ° C and oxide films are all TEOS USG ( Undoped Silicon Glass ) . Film ...
Page 219
... ( SOG ) films have been developed to achieve this low dielectric constant but have their own drawbacks including ; high cost , questionable film purity and stability , negative environmental impact , toxic solvent systems , cracking , and ...
... ( SOG ) films have been developed to achieve this low dielectric constant but have their own drawbacks including ; high cost , questionable film purity and stability , negative environmental impact , toxic solvent systems , cracking , and ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch