Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 66
... Semiconductors ( Semiconductor Industry Association ; San Jose , CA ; 1994 ) 3. Y. Du and J. A. Gardella , Jr. , J. Vac . Science and Technol . A13 , 1907 ( 1995 ) 4. A. Dean , Langes Handbook of Chemistry , 14th ed .; ( McGraw - Hill ...
... Semiconductors ( Semiconductor Industry Association ; San Jose , CA ; 1994 ) 3. Y. Du and J. A. Gardella , Jr. , J. Vac . Science and Technol . A13 , 1907 ( 1995 ) 4. A. Dean , Langes Handbook of Chemistry , 14th ed .; ( McGraw - Hill ...
Page 182
... ( Semiconductor Systems ) , Bob Bryant ( Schumacher ) , Somnath Nag ( Texas Instruments ) , Dipankar Pramanik ( VLSI Technology ) , Alan Levine ( Wright Williams & Kelly ) . References 1 The National Technology Roadmap for Semiconductors ...
... ( Semiconductor Systems ) , Bob Bryant ( Schumacher ) , Somnath Nag ( Texas Instruments ) , Dipankar Pramanik ( VLSI Technology ) , Alan Levine ( Wright Williams & Kelly ) . References 1 The National Technology Roadmap for Semiconductors ...
Page 260
... Semiconductors , Semiconductor Industry Association , San Jose , CA , 1994 . [ 2 ] M.T. Bohr , Technical Digest of International Electron Devices Meeting , 1995 , p . 241 . [ 3 ] K.L. Mittal , Polyimides : Synthesis , Characterization ...
... Semiconductors , Semiconductor Industry Association , San Jose , CA , 1994 . [ 2 ] M.T. Bohr , Technical Digest of International Electron Devices Meeting , 1995 , p . 241 . [ 3 ] K.L. Mittal , Polyimides : Synthesis , Characterization ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch