Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 28
Page 241
... ( Si - F ) / ( Si - O + SI - F ) % ( FTIR ) Fig . 2. Correlation of Si - F % ( FTIR ) with atomic [ F ] % ( RBS ) for FTEOS films . Figure 3 shows the dielectric constant ( Ê ) values as obtained by the capacitance- voltage ( C - V ) ...
... ( Si - F ) / ( Si - O + SI - F ) % ( FTIR ) Fig . 2. Correlation of Si - F % ( FTIR ) with atomic [ F ] % ( RBS ) for FTEOS films . Figure 3 shows the dielectric constant ( Ê ) values as obtained by the capacitance- voltage ( C - V ) ...
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during measurement . The lack of a decrease in к with increasing Si - F concentration is an indication of the instability of these films . Figure 4 shows the effect of increasing F concentration on the Si - F peak intensity , as ...
during measurement . The lack of a decrease in к with increasing Si - F concentration is an indication of the instability of these films . Figure 4 shows the effect of increasing F concentration on the Si - F peak intensity , as ...
Page 274
... F is fixed , the ratio of Si to O is also determined . The number of Si - O bonds / Si atom ( Nsi - 0 ) is equal to ( 6-2x ) / ( 2 - x ) , and the number of Si - F bonds / Si atom ( Nsi - F ) is equal to ( 2-2x ) / ( 2 - x ) . Figure 1 ...
... F is fixed , the ratio of Si to O is also determined . The number of Si - O bonds / Si atom ( Nsi - 0 ) is equal to ( 6-2x ) / ( 2 - x ) , and the number of Si - F bonds / Si atom ( Nsi - F ) is equal to ( 2-2x ) / ( 2 - x ) . Figure 1 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch