Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 74
... Solid State Devices and Materials , Osaka , 1995 , pp605-607 . 7. N.Hayasaka , H.Miyajima , Y.Nakasaki and R.Katsumata Extended Abstracts of International Conference on Solid State Devices and Materials , Osaka , 1995 , pp157-159 . 8. W ...
... Solid State Devices and Materials , Osaka , 1995 , pp605-607 . 7. N.Hayasaka , H.Miyajima , Y.Nakasaki and R.Katsumata Extended Abstracts of International Conference on Solid State Devices and Materials , Osaka , 1995 , pp157-159 . 8. W ...
Page 247
... Solid State Technology , pp . 83-90 , March 1996 . 4. H. Oyamatsu , K. Kasai , N. Matsunaga , H. Igarashi , T. Yamaguchi , T. Asamura , A. Azuma , H. Shibata , M. Kinugawa , and M. Kakumu , Proc . IEDM , pp . 705-708 , ( 1995 ) . 5. H ...
... Solid State Technology , pp . 83-90 , March 1996 . 4. H. Oyamatsu , K. Kasai , N. Matsunaga , H. Igarashi , T. Yamaguchi , T. Asamura , A. Azuma , H. Shibata , M. Kinugawa , and M. Kakumu , Proc . IEDM , pp . 705-708 , ( 1995 ) . 5. H ...
Page 278
... Solid State Device and Materials ( Business Center for Acad . Soc . Japan , Tokyo , 1995 ) p . 157 . 6 ) J.A. Theil , D.V. Tsu , S.S.Kim and G. Lucovsky : J. Vac . Sci . Technol . A 8 , 1374 ( 1990 ) . 7 ) G. Burns , Solid State Physics ...
... Solid State Device and Materials ( Business Center for Acad . Soc . Japan , Tokyo , 1995 ) p . 157 . 6 ) J.A. Theil , D.V. Tsu , S.S.Kim and G. Lucovsky : J. Vac . Sci . Technol . A 8 , 1374 ( 1990 ) . 7 ) G. Burns , Solid State Physics ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch