Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 80
... Symp . Proc . 427 , 415 ( 1996 ) . [ 3 ] . Papers in Low - Dielectric Constant Materials - Synthesis and Application in Microelectronics , edited by T.-M. Lu , S. P. Murarka , T. -S . Kuan and C. H. Ting , Mat . Res . Soc . Symp . Proc ...
... Symp . Proc . 427 , 415 ( 1996 ) . [ 3 ] . Papers in Low - Dielectric Constant Materials - Synthesis and Application in Microelectronics , edited by T.-M. Lu , S. P. Murarka , T. -S . Kuan and C. H. Ting , Mat . Res . Soc . Symp . Proc ...
Page 182
... Symp . Proc . , vol.427 , p.3-16 , 1996 . 3 B. Zhao , S.-Q. Wang , S. Anderson , R. Lam , M. Fiebig , P. K. Vasudev , and T. E. Seidel , Mater . Res . Soc . Symp . Proc . , vol . 427 , p.415-426 , 1996 . 4 G. Sugahara , N. Aoi , M. Kubo ...
... Symp . Proc . , vol.427 , p.3-16 , 1996 . 3 B. Zhao , S.-Q. Wang , S. Anderson , R. Lam , M. Fiebig , P. K. Vasudev , and T. E. Seidel , Mater . Res . Soc . Symp . Proc . , vol . 427 , p.415-426 , 1996 . 4 G. Sugahara , N. Aoi , M. Kubo ...
Page 247
... Symp . on VLSI Tech . , pp . 84-85 , ( 1996 ) . 6. J. Ida , M. Yoshimaru , T. Usami , A. Ohtomo , K. Shimokawa , A Kita , and M. Ino , Symp . on VLSI Tech . , pp . 59-60 , ( 1994 ) . 7. A. Saproo , D.R. Denison and J. Lam , Proc . of ...
... Symp . on VLSI Tech . , pp . 84-85 , ( 1996 ) . 6. J. Ida , M. Yoshimaru , T. Usami , A. Ohtomo , K. Shimokawa , A Kita , and M. Ino , Symp . on VLSI Tech . , pp . 59-60 , ( 1994 ) . 7. A. Saproo , D.R. Denison and J. Lam , Proc . of ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch