Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 46
... TEOS USG ( Undoped Silicon Glass ) . Film thickness and non - uniformity of blanket films were measured on a Tencor SM - 300 system with a 49 point scan and 5 mm edge exclusion . The non - uniformity was reported as lo standard ...
... TEOS USG ( Undoped Silicon Glass ) . Film thickness and non - uniformity of blanket films were measured on a Tencor SM - 300 system with a 49 point scan and 5 mm edge exclusion . The non - uniformity was reported as lo standard ...
Page 47
... TEOS ( solid square ) due to less polymer formation , providing a means of tuning etch selectivity . The SOG non ... TEOS ER : 418 ONU : TEOS O ONU : 418 100 150 200 250 300 350 PRESSURE ( mTorr ) 500 0 Figure 2. SOG - 418 / TEOS etch ...
... TEOS ( solid square ) due to less polymer formation , providing a means of tuning etch selectivity . The SOG non ... TEOS ER : 418 ONU : TEOS O ONU : 418 100 150 200 250 300 350 PRESSURE ( mTorr ) 500 0 Figure 2. SOG - 418 / TEOS etch ...
Page 48
... TEOS as compared to the selectivity of 0.6-0.7 for T11 / TEOS . 1.6 1.4 1.2 ETCH SELECTIVITY 1 0.8 0.6 0.4 ш 0.2 0 0 0.5 1 GAS FLOW RATIO CF4 : CHF3 1.5 T11 / TEOS 418 / TEOS Figure 5. Etch rate selectivities of SOG - T11 and SOP - 418 over ...
... TEOS as compared to the selectivity of 0.6-0.7 for T11 / TEOS . 1.6 1.4 1.2 ETCH SELECTIVITY 1 0.8 0.6 0.4 ш 0.2 0 0 0.5 1 GAS FLOW RATIO CF4 : CHF3 1.5 T11 / TEOS 418 / TEOS Figure 5. Etch rate selectivities of SOG - T11 and SOP - 418 over ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch