Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 61
MOCVD OF Cu ON TEFLON - AF AND ALUMINA - MODIFIED TEFLON - AF D. Martini , R. Sutcliffe , and J. Kelber Department of Chemistry , University of North Texas ABSTRACT XPS studies of Cu ( I ) hfac ( COD ) adsorbed on clean and alumina ...
MOCVD OF Cu ON TEFLON - AF AND ALUMINA - MODIFIED TEFLON - AF D. Martini , R. Sutcliffe , and J. Kelber Department of Chemistry , University of North Texas ABSTRACT XPS studies of Cu ( I ) hfac ( COD ) adsorbed on clean and alumina ...
Page 64
... Teflon - AF 1. TMA on Teflon - AF Binding Energy ( eV ) Fig . 3 Cu ( 2p ) and Cu ( L , VV ) spectra for Cu ( I ) hfac ( COD ) adsorption on an alumina - modified Teflon - AF surface at 110 K followed by annealing in UHV to 300 K ...
... Teflon - AF 1. TMA on Teflon - AF Binding Energy ( eV ) Fig . 3 Cu ( 2p ) and Cu ( L , VV ) spectra for Cu ( I ) hfac ( COD ) adsorption on an alumina - modified Teflon - AF surface at 110 K followed by annealing in UHV to 300 K ...
Page 66
... Teflon - AF and alumina - modified Teflon - AF under UHV conditions . The results show that for both substrates , multilayer adsorption of the precursor and decomposition products occurs at 110 K. In both cases , annealing to 300 K ...
... Teflon - AF and alumina - modified Teflon - AF under UHV conditions . The results show that for both substrates , multilayer adsorption of the precursor and decomposition products occurs at 110 K. In both cases , annealing to 300 K ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch