Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 80
... ULSI Multi . Inter . Conf . , 297 ( 1995 ) . [ 10 ] . K. S. Y. Lau , N. H. Hendricks , A. R. Smith and W. B. Wan , Proc . Dielc . for VLSI / ULSI Multi . Inter . Conf . , 126 ( 1995 ) . [ 11 ] . D. A. Babb , B. R. Ezzel , K. S. Clement ...
... ULSI Multi . Inter . Conf . , 297 ( 1995 ) . [ 10 ] . K. S. Y. Lau , N. H. Hendricks , A. R. Smith and W. B. Wan , Proc . Dielc . for VLSI / ULSI Multi . Inter . Conf . , 126 ( 1995 ) . [ 11 ] . D. A. Babb , B. R. Ezzel , K. S. Clement ...
Page 177
... ULSI interconnection were sorted to create generic process flows . Average material and equipment costs were then used as inputs to a generic cost - per - wafer ( CPW ) model for dielectric deposition ( not including the costs of ...
... ULSI interconnection were sorted to create generic process flows . Average material and equipment costs were then used as inputs to a generic cost - per - wafer ( CPW ) model for dielectric deposition ( not including the costs of ...
Page 182
... ULSI Multilevel Interconnection Conference , p . 19-25 , 1997 . 5 T. Ramos , K. Roderick , R. Roth , S. Wallace , N. Hendricks , N. Rutherford , J. Drage , S.Q. Wang , and D.M. Smith , Proc . of Dielectrics for ULSI Multilevel ...
... ULSI Multilevel Interconnection Conference , p . 19-25 , 1997 . 5 T. Ramos , K. Roderick , R. Roth , S. Wallace , N. Hendricks , N. Rutherford , J. Drage , S.Q. Wang , and D.M. Smith , Proc . of Dielectrics for ULSI Multilevel ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch