Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 127
... VLSI Multilevel Interconnection Conference ( VMIC ) , Santa Clara , ( 1995 ) pp . 138-140 . K. S. Y. Lau , N. H. Hendricks , A. R. Smith , and W. B. Wan , in Proceedings of the 12th International VLSI Multilevel Interconnection ...
... VLSI Multilevel Interconnection Conference ( VMIC ) , Santa Clara , ( 1995 ) pp . 138-140 . K. S. Y. Lau , N. H. Hendricks , A. R. Smith , and W. B. Wan , in Proceedings of the 12th International VLSI Multilevel Interconnection ...
Page 182
... VLSI Multilevel Interconnection Conference , p.23-27 , 1996 . 7 V. McGahay , A. Acovic , B. Agarwala , G. Endicott , D. Nguyen , M. Shapiro , and S. Yankee , Proc . of VLSI Multilevel Interconnection Conference , p.116-118 , 1996 . 8 S ...
... VLSI Multilevel Interconnection Conference , p.23-27 , 1996 . 7 V. McGahay , A. Acovic , B. Agarwala , G. Endicott , D. Nguyen , M. Shapiro , and S. Yankee , Proc . of VLSI Multilevel Interconnection Conference , p.116-118 , 1996 . 8 S ...
Page 219
... VLSI intermetal dielectric applications . All films were deposited in a prototype production system that included a vacuum chamber , electrostatic cold chuck and a parylene vapor delivery system . Chuck temperatures as low as -30 ° C ...
... VLSI intermetal dielectric applications . All films were deposited in a prototype production system that included a vacuum chamber , electrostatic cold chuck and a parylene vapor delivery system . Chuck temperatures as low as -30 ° C ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch